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This document describes how Audio Weaver has been integrated on the Qualcomm Snapdragon SOC using low-level APIs. It bypasses Audio Reach and provides significant performance improvements. This document should be used in conjunction with the generic description of the Audio Weaver architecture described in Audio-Weaver--Architecture. The overall design is flexible enough to handle all automotive use cases and configurations. You should be able to fully engineer your automotive audio system using Audio Weaver without having to write custom Hexagon code1(Unless, of course, you want to write your own custom modules that execute on the Hexagon).
The platform specific code needed to wrap Audio Weaver is referred to as the Board Support Package (BSP). We will use the term BSP throughout this document to describe this code. The BSP code is based on Qualcomm low-level AudioLiteAPIs. This is a low-level software layer which provides an RTOS, TDM port I/O, and basic system features.
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